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FXLP4555MPX - onsemi

Description: Low-Profile 3x3mm MLP-16 Package; Supports 1.8V or 3.0V SIM Cards; LDO Supplies >50mA Under 1.8V and 3.0V; Built-in Pull-up Resistor for I/O Pin in Both Directions; Supports Clock ≥5MHz; Supports "Clock Stop" Power Management per ISO7816-3 Specifications; ESD Protection: 8kV (Human Body Model, According to ISO-7816 Specifications)

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PCB Footprints
FXLP4555MPX - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - FSUSB74MPX
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3D Models
FXLP4555MPX - onsemi  - 3D model - Quad Flat No-Lead - FSUSB74MPX
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FXLP4555MPX Details

  • Manufacturer Part Number:

    FXLP4555MPX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WQFN-16

  • Package Description:

    MLP-16

  • Manufacturer Package Code:

    510BS

  • Country Of Origin:

    Mainland China, Malaysia

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

FXLP4555MPX Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise coupling.
  • Ensure the input voltage is within the recommended range (2.7V to 5.5V) and the output voltage is set to the desired level using the feedback resistors. Also, ensure the bias current is within the recommended range (1mA to 10mA).
  • The FXLP4555MPX can drive up to 10nF of capacitive load. Exceeding this limit may cause instability or oscillations.
  • Use a low-ESR output capacitor (e.g., ceramic or film capacitor) and add a noise-reducing capacitor (e.g., 10nF to 100nF) in parallel with the output capacitor. Also, ensure good PCB layout and decoupling.
  • The FXLP4555MPX is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure proper thermal management and consider derating the device's specifications accordingly.

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FXLP4555MPX Overview

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