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FXLS8471QR1 - NXP

Description: FXLS8471Q:

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PCB Footprints
FXLS8471QR1 - NXP PCB footprint - Pull-back Quad Flat No-lead - Pull-back Quad Flat No-lead - (QFN-COL)0.5pitch(3x3x1)
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FXLS8471QR1 Details

  • Manufacturer Part Number:

    FXLS8471QR1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    3 X 3 MM, 1 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, QFN-16

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRE INTERFACE VOLTAGE OF 1.62V TO 3.6V

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.95 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

FXLS8471QR1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FXLS8471QR1 involves keeping the accelerometer away from high-current carrying traces, using a solid ground plane, and minimizing the distance between the device and the analog ground. A 4-layer PCB with a dedicated analog ground layer is recommended.
  • Calibration involves applying known accelerations to the device and measuring the output. A 2-point or 3-point calibration method can be used, where the device is subjected to +1g and -1g accelerations, and the output is measured and adjusted accordingly.
  • The recommended power-on sequence is to first apply VDD, followed by VDDIO, and then the clock signal. This ensures that the internal voltage regulators are powered up correctly and the device is properly initialized.
  • The HPF and LPF settings can be adjusted to optimize the device's response to different frequency ranges. The HPF can be used to remove DC offsets, while the LPF can be used to reduce noise. The optimal settings depend on the specific application and can be determined through experimentation and testing.
  • The FXLS8471QR1 is rated for operation from -40°C to 125°C, but the device's accuracy and performance may degrade at extreme temperatures. It's essential to consider the operating temperature range when designing the system and to ensure proper thermal management.

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FXLS8471QR1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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