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GBJ2506 - Diodes Incorporated

Description: BRIDGE RECT 1PHASE 600V 25A GBJ

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GBJ2506 - Diodes Incorporated  - 3D model
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GBJ2506 Details

  • Manufacturer Part Number:

    GBJ2506

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, GBJ, 4 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.05 V

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e0

  • Non-rep Pk Forward Current-Max:

    350 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Lead (Sn85Pb15)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

GBJ2506 Frequently Asked Questions (FAQs)

  • A good PCB layout for the GBJ2506 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a common ground point for the input and output grounds.
  • To ensure proper thermal management, it's recommended to attach the GBJ2506 to a heat sink or a metal core PCB, and to use thermal interface material to fill any gaps. The device should also be placed in a well-ventilated area to prevent overheating.
  • Exceeding the maximum junction temperature of the GBJ2506 can lead to reduced lifespan, decreased performance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • While the GBJ2506 is a high-performance device, it's essential to evaluate its suitability for high-reliability or automotive applications. Diodes Incorporated provides additional documentation and support for these applications, including AEC-Q100 qualification and PPAP (Production Part Approval Process) documentation.
  • To troubleshoot issues with the GBJ2506, start by verifying the device is properly soldered and the PCB layout is correct. Check for signs of overheating, such as excessive temperature or burning smells. Use a multimeter to measure voltage and current, and consult the datasheet and application notes for guidance on troubleshooting and fault diagnosis.

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GBJ2506 Overview

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