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GBPC2510 - onsemi

Description: Surge overload rartings from 300 A to 400 A; Terminals Finish Material - Silver (solderable per MIL-STD-202, Method 208 for the wire type GBPC-W package), - Nickel for GBPC package; Integrally molded heatsink provided very low thermal resistance for maximum heat dissipation; Isolated voltage from case to lead over 2500 V; UL certified, UL #E258596

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GBPC2510 - onsemi  - 3D model
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GBPC2510 Details

  • Manufacturer Part Number:

    GBPC2510

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    GBPC4 28.75x28.75x11.10

  • Manufacturer Package Code:

    160AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.85

  • Breakdown Voltage-Min:

    1000 V

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    S-XUFM-D4

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    83.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Nickel (Ni)

  • Terminal Form:

    SOLDER LUG

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

GBPC2510 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a heat sink with a thermal resistance of 10°C/W or lower, and ensure good airflow. Also, derate the current handling capability at high temperatures.
  • The device can handle surge currents up to 100A for 10ms, but this may affect the device's lifespan. Consult the application note for more information.
  • Yes, but ensure the switching frequency is below 100kHz to minimize losses. Also, consider using a snubber circuit to reduce EMI.
  • Use a TVS diode for overvoltage protection and a fuse or PPTC resettable fuse for overcurrent protection. Also, consider using a current sense resistor and a comparator to detect overcurrent conditions.

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GBPC2510 Overview

Use the download button to access the GBPC2510 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like GBPC2, or try a keyword search, such as Bridge Rectifier Diodes

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For a full list of alternate parts for GBPC2510, check out Findchips.com