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GS88236CGD-200I - GSI TECHNOLOGY

Description: Cache SRAM, 256KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

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GS88236CGD-200I Details

  • Manufacturer Part Number:

    GS88236CGD-200I

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

  • Pin Count:

    165

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.B.2.B

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    GSI Technology

  • YTEOL:

    5.75

  • Access Time-Max:

    6.5 ns

  • Additional Feature:

    PIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY

  • JESD-30 Code:

    R-PBGA-B165

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    CACHE SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    165

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX36

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max (Vsup):

    2.7 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

GS88236CGD-200I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the GS88236CGD-200I is -40°C to +85°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of 0°C to 70°C for optimal performance and reliability.
  • To ensure signal integrity on the high-speed interfaces of the GS88236CGD-200I, it's essential to follow proper PCB design guidelines, such as using controlled impedance traces, minimizing signal routing distances, and using signal termination resistors. Additionally, ensure that the power supply is clean and stable, and that the device is properly decoupled.
  • The recommended power-up sequence for the GS88236CGD-200I is to first apply the core voltage (VDD), followed by the input/output voltage (VDDQ). Ensure that the power supplies are stable and within the recommended voltage ranges before applying the clock signal.
  • The GS88236CGD-200I provides various error detection and correction mechanisms, such as parity and ECC. It's essential to implement error handling mechanisms in the system design to detect and correct errors. Additionally, ensure that the system is designed to handle exceptions, such as bus errors and timeouts, to prevent system crashes or data corruption.
  • The recommended clock signal quality for the GS88236CGD-200I is a low-jitter, high-frequency clock signal with a stable amplitude. Ensure that the clock signal is generated by a high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL).

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GS88236CGD-200I Overview

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