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HA3-2525-5Z - Renesas Electronics

Description: HA-2520, HA-2522, HA-2525 comprise a series of operational amplifiers delivering an unsurpassed combination of specifications for slew rate, bandwidth and settling time. These dielectrically isolated amplifiers are controlled at closed loop gains greater than 3 without external compensation. In addition, these high performance components also provide low offset current and high input impedance. 120V/µs slew rate and 200ns (0. 2%) settling time of these amplifiers make them ideal components for pulse amplifi

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HA3-2525-5Z - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - E8.3 (JEDEC MS-001-BA ISSUE D) 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
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HA3-2525-5Z - Renesas Electronics  - 3D model - Dual-In-Line Packages - E8.3 (JEDEC MS-001-BA ISSUE D) 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
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HA3-2525-5Z Details

  • Manufacturer Part Number:

    HA3-2525-5Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    E8.3

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.5 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    14000 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.585 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    75 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.33 mm

  • Slew Rate-Min:

    80 V/us

  • Slew Rate-Nom:

    120 V/us

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    20000

  • Voltage Gain-Min:

    5000

  • Wideband:

    NO

  • Width:

    7.62 mm

HA3-2525-5Z Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermal shield or a heat sink with a thermal interface material to reduce thermal resistance.
  • The recommended soldering conditions are: peak temperature of 260°C, soldering time of 10 seconds, and a temperature slope of 3°C/s. Use a solder with a melting point of 217°C to 221°C.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads.
  • Use an ESD wrist strap or mat, and handle the devices in an ESD-protected environment. Avoid touching the leads or device body, and use ESD-protected packaging and storage materials.

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HA3-2525-5Z Overview

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