HC9-100-R footprint, schematic symbol and 3D model by Eaton

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HC9-100-R Details

The recommended PCB land pattern for the HC9-100-R is a rectangular pad with a minimum size of 50 mils x 30 mils (1.27 mm x 0.76 mm) with a non-solder mask defined (NSMD) pad.
The HC9-100-R has a maximum operating temperature of 125°C. Ensure good airflow around the inductor, and consider using a heat sink or thermal interface material if operating in high-temperature environments.
The SRF of the HC9-100-R is not explicitly stated in the datasheet, but it can be estimated to be around 100-150 MHz based on the inductor's physical characteristics and similar products from Coiltronics.
While the HC9-100-R has a high current rating, it's essential to consider the inductor's DC resistance (DCR) and the resulting power loss. Ensure the inductor is operated within its specified current rating and consider using a larger inductor or an array of inductors in parallel for high-current applications.
To minimize EMI, ensure the HC9-100-R is properly shielded, and the PCB layout is designed to minimize radiation. Consider using a shielded inductor or adding a shield can around the inductor to reduce EMI.

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