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HC9P5504B-5Z - Renesas Electronics

Description: The Intersil SLIC incorporates many of the BORSHT functions on a single IC chip. This includes DC battery feed, a ring relay driver, supervisory and hybrid functions. This device is designed to maintain transmission performance in the presence of externally induced longitudinal currents. Using the unique Intersil dielectric isolation process, the SLIC can operate directly with a wide range of station battery voltages. The SLIC also provides selective denial of power. If the PBX system becomes overloaded dur

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HC9P5504B-5Z - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 24 Ld SOIC (Pb-free)
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HC9P5504B-5Z - Renesas Electronics  - 3D model - Small Outline Packages - 24 Ld SOIC (Pb-free)
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HC9P5504B-5Z Details

  • Manufacturer Part Number:

    HC9P5504B-5Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICW

  • Package Description:

    SOIC-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    M24.3

  • Country Of Origin:

    Mainland China, Malaysia, Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-19

  • Manufacturer:

    Renesas Electronics Corporation

  • Battery Feed:

    CONSTANT CURRENT

  • Hybrid:

    2-4 CONVERSION

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Nom:

    -48 V

  • Noise-Max:

    5 dBrnC

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    75 °C

  • PSRR-Min:

    15 dB

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    SLIC

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

HC9P5504B-5Z Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide for the HC9P5504B-5Z, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance. Contact Renesas support for more information.
  • The HC9P5504B-5Z has a specific power-up sequence requirement to ensure proper operation. The recommended power-up sequence is VCC, then VDD, and finally EN. A delay of at least 10ms is recommended between each power-up step.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to note that the device's performance and reliability may degrade at extreme temperatures. For optimal performance, it's recommended to operate the device within a temperature range of 0°C to 85°C.
  • For I2C interface issues, check the pull-up resistor values, ensure proper signal routing, and verify that the I2C clock frequency is within the recommended range. Also, use a logic analyzer or oscilloscope to debug the I2C bus signals.
  • Renesas recommends using a decoupling capacitor configuration with a 10uF capacitor in parallel with a 100nF capacitor, placed as close as possible to the device's power pins. This configuration helps to reduce noise and ensure stable operation.

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HC9P5504B-5Z Overview

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