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HC9P5504B-5ZX96 - Renesas Electronics

Description: The Intersil SLIC incorporates many of the BORSHT functions on a single IC chip. This includes DC battery feed, a ring relay driver, supervisory and hybrid functions. This device is designed to maintain transmission performance in the presence of externally induced longitudinal currents. Using the unique Intersil dielectric isolation process, the SLIC can operate directly with a wide range of station battery voltages. The SLIC also provides selective denial of power. If the PBX system becomes overloaded dur

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HC9P5504B-5ZX96 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
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HC9P5504B-5ZX96 Details

  • Manufacturer Part Number:

    HC9P5504B-5ZX96

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICW

  • Package Description:

    SOIC-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    M24.3

  • Country Of Origin:

    Mainland China, Malaysia, Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-19

  • Manufacturer:

    Renesas Electronics Corporation

  • Battery Feed:

    CONSTANT CURRENT

  • Hybrid:

    2-4 CONVERSION

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Nom:

    -48 V

  • Noise-Max:

    5 dBrnC

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    75 °C

  • PSRR-Min:

    15 dB

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    SLIC

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

HC9P5504B-5ZX96 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide for the HC9P5504B-5ZX96, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance. It's essential to follow this guide to prevent overheating and ensure reliable operation.
  • The HC9P5504B-5ZX96 has an internal overcurrent protection (OCP) feature, but it's not enabled by default. To implement OCP, you need to connect an external resistor (Rocp) between the OCP pin and GND, and set the OCP threshold using the I2C interface. Refer to the application note for detailed instructions.
  • The recommended power-up sequence for the HC9P5504B-5ZX96 is to first apply the power supply voltage (VCC) and then the input voltage (VIN). This ensures that the internal voltage regulators and other circuits are properly initialized. A reverse power-up sequence may cause malfunction or damage to the device.
  • To troubleshoot I2C communication issues, check the I2C bus voltage levels, clock frequency, and signal integrity. Ensure that the I2C bus is properly terminated, and the slave address is correctly set. Use an I2C analyzer or logic analyzer to capture and analyze the I2C traffic. Refer to the I2C specification and the device's datasheet for more information.
  • The maximum allowed voltage on the input pins of the HC9P5504B-5ZX96 is 5.5V, which is the absolute maximum rating. Exceeding this voltage may cause damage to the device. Ensure that the input voltage is within the recommended operating range to ensure reliable operation.

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