HET-A-02C - TE Connectivity
Description: Body Features: Insert Type Solder Preform with Activated Rosin Flux | Interconnect Device Shield Material Copper Braid with Activated Rosin Flux | Insert Material Sn96 Ag Solder Alloy | Configuration Features: 22 AWG Shielded Pairs (Max) 2 | 20 AWG Shielded Pairs (Max) 1 | Contact Features: Ferrule Plating Material Electroless Nickel | Dimensions: Cable Shield Diameter (Max) .21 INCH | Compatible Wire Bundle Diameter (Max) 4.2 MM | Cable Shield Diameter (Max) 5.3 MM | Compatible Cable Bundle Diameter (Max)
ECAD model is currently unavailable for this part
