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HET-A-05C - TE Connectivity

Description: Body Features: Interconnect Device Shield Material Solder Impregnated, Flux Coated Copper | Insert Type Solder | Contact Features: Ferrule Plating Material Electroless Nickel | Dimensions: Compatible Wire Bundle Diameter (Max) .295 INCH | Cable Shield Diameter (Min) .157 INCH | Compatible Wire Bundle Diameter (Max) 7.5 MM | Cable Shield Diameter (Max) 11.8 MM | Cable Shield Diameter (Max) .465 INCH | Compatible Cable Bundle Diameter (Min) .197 INCH | Compatible Cable Bundle Diameter (Min) 5 MM | Cable Shiel

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HET-A-05C Overview

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