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HFA3096BZ - Renesas Electronics

Description: The HFA3046, HFA3096, HFA3127 and the HFA3128 are ultra high frequency transistor arrays that are fabricated from the Renesas complementary bipolar UHF-1 process. Each array consists of five dielectrically isolated transistors on a common monolithic substrate. The NPN transistors exhibit a fT of 8GHz while the PNP transistors provide a fT of 5. 5GHz. Both types exhibit low noise (3. 5dB), making them ideal for high frequency amplifier and mixer applications. The HFA3046 and HFA3127 are all NPN arrays while

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HFA3096BZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 16 Ld SOIC_
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HFA3096BZ Details

  • Manufacturer Part Number:

    HFA3096BZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.15

  • Country Of Origin:

    Mainland China, Malaysia, Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.037 A

  • Collector-Base Capacitance-Max:

    0.2 pF

  • Collector-Emitter Voltage-Max:

    8 V

  • Configuration:

    SEPARATE, 5 ELEMENTS

  • DC Current Gain-Min (hFE):

    40

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    MS-012AC

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    5

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Power Dissipation-Max (Abs):

    0.15 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    8000 MHz

HFA3096BZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a common mode filter or a ferrite bead to reduce EMI.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) for power decoupling, placed as close to the device as possible. Ensure the power supply is stable and within the recommended voltage range (2.7V to 5.5V).
  • The recommended clock frequency is 12.288 MHz, with a clock signal quality of < 100 ppm frequency deviation and < 100 ps jitter.
  • Use the power-down mode (PD pin) to reduce power consumption when the device is not in use. Adjust the clock frequency and voltage regulator settings to minimize power consumption. Use the built-in low-power modes (e.g., idle mode) when possible.
  • The HFA3096BZ has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device will be operating in a high-temperature environment.

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HFA3096BZ Overview

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