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HI1-0201HS-5 - Renesas Electronics

Description: CMOS Analog Switch

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HI1-0201HS-5 - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - F16.3
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HI1-0201HS-5 - Renesas Electronics  - 3D model - Ceramic Dual-In-Line Packages - F16.3
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HI1-0201HS-5 Details

  • Manufacturer Part Number:

    HI1-0201HS-5

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DIP-16

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2020-01-22

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-CDIP-T16

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    72 dB

  • On-state Resistance-Max (Ron):

    75 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Supply Current-Max (Isup):

    10 mA

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    50 ns

  • Switch-on Time-Max:

    50 ns

  • Technology:

    CMOS

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

HI1-0201HS-5 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout and thermal management guide in their application notes (e.g., AN1841) and design guides (e.g., DG-00234). It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and reliability.
  • The HI1-0201HS-5 has built-in overcurrent protection, but it's recommended to implement additional external protection circuits to detect and respond to faults. Renesas provides guidance on fault detection and protection in their application notes and design guides.
  • Renesas recommends following a specific power-up and power-down sequence to ensure proper device operation and prevent damage. This information can be found in the device's datasheet and application notes.
  • To minimize standby current and optimize low-power consumption, follow Renesas' guidelines for power-saving modes, clock management, and voltage regulation. Additionally, consider using external components and design techniques to reduce power consumption.
  • Renesas provides thermal characteristics and guidelines for thermal management in the datasheet and application notes. Ensure proper heat sinking, thermal interface materials, and design for reliable operation at high temperatures.

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