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HI1-0508/883 - Renesas Electronics

Description: The HI-508/883 is an eight channel single-ended multiplexer. This monolithic CMOS multiplexer includes an array of eight analog switches, a digital decode circuit for channel selection, a voltage reference for logic thresholds, and an ENABLE input for device selection when several multiplexers are present. The Dielectric Isolation (DI) process used in fabrication of this device eliminates the problem of latch-up. Also, DI offers much lower substrate leakage and parasitic capacitance than conventional juncti

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HI1-0508/883 - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - F16.3-1
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HI1-0508/883 Details

  • Manufacturer Part Number:

    HI1-0508/883

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CERDIP

  • Package Description:

    CERDIP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    F16.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.05 mm

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO/NC

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    68 dB

  • On-state Resistance Match-Nom:

    9 Ω

  • On-state Resistance-Max (Ron):

    300 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    240

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

HI1-0508/883 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AN1844) for the HI1-0508/883, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal shutdown or warning mechanisms if necessary.
  • Using a different voltage regulator or power supply may affect the HI1-0508/883's performance, stability, and reliability. Ensure that the chosen power supply meets the recommended voltage and current requirements, and consider the power supply's noise, ripple, and transient response characteristics to avoid any potential issues.
  • Renesas provides a troubleshooting guide in their application note (AN1845) for the HI1-0508/883, which covers common issues, error codes, and debugging techniques. Additionally, consider using oscilloscopes, logic analyzers, or other diagnostic tools to identify and isolate problems.
  • To ensure EMC and EMI compliance, follow the recommended PCB layout and design guidelines, use shielding and filtering components as necessary, and consider implementing EMI mitigation techniques such as spread spectrum clocking or EMI filters. Additionally, perform EMC and EMI testing to validate the design.

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HI1-0508/883 Overview

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Part Image HI1-508/883 Renesas Electronics Corporation

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Part Image DG508ACK Intersil Corporation

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Part Image M38510/19007BEA Harris Semiconductor

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