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HI9P0201-9Z - Renesas Electronics

Description: HI-200/HI-201 (dual/quad) are monolithic devices comprising independently selectable SPST switches which feature fast switching speeds (HI-200 240ns, and HI-201 185ns) combined with low power dissipation (15mW at 25°C). Each switch provides low ON resistance operation for input signal voltage up to the supply rails and for signal current up to 80mA. Rugged DI construction eliminates latch-up and substrate SCR failure modes. All devices provide break-before-make switching and are TTL and CMOS compatible for

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PCB Footprints
HI9P0201-9Z - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M16.15 Rev 2, 11/17
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3D Models
HI9P0201-9Z - Renesas Electronics  - 3D model - Small Outline Packages - M16.15 Rev 2, 11/17
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HI9P0201-9Z Details

  • Manufacturer Part Number:

    HI9P0201-9Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.15

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    80 dB

  • On-state Resistance-Max (Ron):

    80 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Supply Current-Max (Isup):

    2 mA

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

HI9P0201-9Z Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for HI9P0201-9Z is -40°C to 125°C.
  • To ensure reliable data transmission with HI9P0201-9Z, use a stable clock source, ensure proper signal termination, and follow the recommended PCB layout guidelines.
  • The maximum data transfer rate supported by HI9P0201-9Z is up to 100 Mbps.
  • HI9P0201-9Z has built-in POR and BOD circuits. Ensure that the power supply is stable and within the recommended voltage range to prevent false resets.
  • Use a 0.1 μF ceramic capacitor and a 10 μF electrolytic capacitor in parallel, placed close to the power pins, to ensure stable power supply decoupling.

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HI9P0201-9Z Overview

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