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HIP2101IR4ZT - Renesas Electronics

Description: The HIP2101 is a high frequency, 100V Half Bridge N-Channel power MOSFET driver IC. It is equivalent to the HIP2100 with the added advantage of full TTL/CMOS compatible logic input pins. The low-side and high-side gate drivers are independently controlled and matched to 13ns. This gives users total control over dead time for specific power circuit topologies. Undervoltage protection on both the low-side and high-side supplies force the outputs low. An on-chip diode eliminates the discrete diode required wit

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HIP2101IR4ZT - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - L12.4x4A
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HIP2101IR4ZT - Renesas Electronics  - 3D model - Small Outline No-lead - L12.4x4A
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HIP2101IR4ZT Details

  • Manufacturer Part Number:

    HIP2101IR4ZT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    L12.4X4A

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N12

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.16,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    3.4 mA

  • Supply Voltage-Max:

    14 V

  • Supply Voltage-Min:

    9 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    122 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.056 µs

  • Turn-on Time:

    0.056 µs

  • Width:

    4 mm

HIP2101IR4ZT Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the HIP2101 application note (R16AN0074) which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power handling capability according to the temperature derating curve provided in the datasheet.
  • Although the datasheet specifies a recommended operating voltage range of 4.5V to 5.5V, the absolute maximum rating for the VCC pin is 6.5V. However, it's recommended to operate the device within the specified range to ensure reliable operation and minimize the risk of damage.
  • To troubleshoot issues with the overcurrent protection, check the OCP pin's voltage level, ensure the sense resistor is correctly sized and connected, and verify that the OCP threshold is set correctly. Also, review the application note (R16AN0074) for guidance on OCP configuration and troubleshooting.
  • Yes, the HIP2101 is qualified for automotive and high-reliability applications. Renesas provides additional documentation, such as the Automotive Reliability Report and the Failure Mode Effects and Diagnostics Analysis (FMEDA) report, to support the device's use in these applications.

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