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HSMP-3822-TR1G - Avago Technologies

Description: BROADCOM - HSMP-3822-TR1G - RF / Pin Diode, Switching, Dual Series, 0.6 ohm, 50 V, SOT-23, 3 Pin, 0.8 pF

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PCB Footprints
HSMP-3822-TR1G - Avago Technologies PCB footprint - Other - Other - SOT-23
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3D Models
HSMP-3822-TR1G - Avago Technologies  - 3D model - Other - SOT-23
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HSMP-3822-TR1G Details

  • Manufacturer Part Number:

    HSMP-3822-TR1G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    R-PDSO-G3

  • Pin Count:

    3

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    0

  • Additional Feature:

    LOW DISTORTION

  • Application:

    SWITCHING

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Capacitance-Max:

    0.8 pF

  • Diode Capacitance-Nom:

    0.6 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    0.6 Ω

  • Diode Res Test Current:

    10 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Minority Carrier Lifetime-Nom:

    0.07 µs

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.25 W

  • Qualification Status:

    Not Qualified

  • Reverse Test Voltage:

    20 V

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

HSMP-3822-TR1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout and thermal management for HSMP-3822-TR1G can be found in the Broadcom application note AN1353, which provides guidelines for PCB design, thermal management, and assembly.
  • To optimize the performance of HSMP-3822-TR1G, it is recommended to consult with Broadcom's technical support team, who can provide customized guidance based on the specific application and use case.
  • HSMP-3822-TR1G has undergone rigorous reliability and qualification tests, including temperature cycling, humidity testing, and mechanical stress testing, as outlined in the JEDEC standards.
  • While HSMP-3822-TR1G is primarily designed for Wi-Fi applications, it can be used in other non-Wi-Fi applications with proper evaluation and testing to ensure compatibility and performance.
  • The lead time and availability of HSMP-3822-TR1G can vary depending on the region and distributor. It is recommended to check with authorized distributors or Broadcom's sales team for the latest information.

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HSMP-3822-TR1G Overview

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Part Image HSMP-3822T32 Avago Technologies

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