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HSMS-2852-TR1G - Avago Technologies

Description: BROADCOM - HSMS-2852-TR1G - RF Schottky Diode, Zero Bias, Dual Series, 2 V, 1 mA, 250 mV, 0.3 pF, SOT-23

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HSMS-2852-TR1G - Avago Technologies - PCB symbol
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PCB Footprints
HSMS-2852-TR1G - Avago Technologies PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 23 (SOT-23)_
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3D Models
HSMS-2852-TR1G - Avago Technologies - 3D model - SOT23 (3-Pin) - 23 (SOT-23)_
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HSMS-2852-TR1G Details

  • Manufacturer Part Number:

    HSMS-2852-TR1G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    R-PDSO-G3

  • Pin Count:

    3

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    0

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Frequency-Max:

    4 GHz

  • Operating Frequency-Min:

    0.915 GHz

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Type of Schottky Barrier:

    ZERO BARRIER

HSMS-2852-TR1G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize signal reflections. A 50-ohm microstrip transmission line should be used for the RF signal path.
  • Ensure good thermal conductivity by using a thermal pad or thermal tape to attach the device to a heat sink or metal plate. Also, reduce the power consumption by optimizing the biasing and reducing the operating frequency.
  • Use a TVS (Transient Voltage Suppressor) diode or a zener diode with a voltage rating of 5.5V or higher to protect the device from electrostatic discharge. The ESD protection device should be placed as close as possible to the HSMS-2852-TR1G.
  • Use a spectrum analyzer to check the frequency response and output power of the device. Verify the biasing and power supply voltage. Check for any signs of overheating or physical damage. Consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, HSMS-2852-TR1G can be used in a push-pull configuration to achieve higher output power and improved linearity. However, ensure that the devices are properly matched and biased to avoid uneven current sharing and thermal runaway.

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HSMS-2852-TR1G Overview

Use the download button to access the HSMS-2852-TR1G schematic symbol, PCB footprint, and 3D model.
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HSMS-2852-TR1G Alternates

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For a full list of alternate parts for HSMS-2852-TR1G, check out Findchips.com