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HV264TS-G - Microchip

Description: Operational Amplifiers - Op Amps Quad High Voltage Amplifier Array IC

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HV264TS-G - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 24-Lead Thin Shrink Small Outline Package (QE)
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HV264TS-G - Microchip  - 3D model - Small Outline Packages - 24-Lead Thin Shrink Small Outline Package (QE)
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HV264TS-G Details

  • Manufacturer Part Number:

    HV264TS-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    TSSOP-24

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Additional Feature:

    CAN ALSO OPERATE AS VPP FROM 50V TO 225V

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Number of Channels:

    4

  • Number of Functions:

    4

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

HV264TS-G Frequently Asked Questions (FAQs)

  • A good PCB layout for the HV264TS-G involves keeping the high-voltage traces short and away from low-voltage traces, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable startup and shutdown, make sure to follow the recommended power-up and power-down sequences outlined in the datasheet. Also, ensure that the input voltage rises and falls monotonically, and that the device is not subjected to voltage spikes or dips during startup and shutdown.
  • The HV264TS-G can dissipate up to 2.5W of power, so thermal management is crucial. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Also, follow the recommended PCB layout guidelines to minimize thermal resistance.
  • To troubleshoot issues with the HV264TS-G, start by verifying the power supply voltage, checking for proper decoupling, and ensuring that the input voltage is within the recommended range. Use an oscilloscope to check the output voltage and current, and consult the datasheet for troubleshooting guidelines.
  • Yes, the HV264TS-G is sensitive to electrostatic discharge (ESD). Handle the device by the body, avoid touching the pins, and use ESD-protective packaging and handling procedures. Also, ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD-protection ICs.

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HV264TS-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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