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HV5222PJ-G - Microchip

Description: Serial to Parallel Logic Converters 220V 32Ch Open D Out

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HV5222PJ-G - Microchip - PCB symbol
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PCB Footprints
HV5222PJ-G - Microchip PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - 44J - PLCC
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HV5222PJ-G - Microchip - 3D model - Plastic Leaded Chip Carrier - 44J - PLCC
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HV5222PJ-G Details

  • Manufacturer Part Number:

    HV5222PJ-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.653 X 0.653 INCH, 0.180 INCH HEIGHT, 0.05 INCH PITCH, GREEN, PLASTIC, MS-018AC, LCC-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    PLCC-44

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    EL DISPLAY DRIVER

  • JESD-30 Code:

    S-PQCC-J44

  • JESD-609 Code:

    e3

  • Length:

    16.5862 mm

  • Moisture Sensitivity Level:

    3

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    32

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC44,.7SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    4.572 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    10.8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    16.5862 mm

  • fmax-Min:

    8 MHz

HV5222PJ-G Frequently Asked Questions (FAQs)

  • Microchip provides a recommended layout and routing guide in their application note AN1041, which includes guidelines for PCB design, component placement, and routing to minimize noise and ensure reliable operation.
  • When handling the HV5222PJ-G, it's essential to follow proper ESD precautions and use a wrist strap or mat to prevent static damage. Additionally, ensure that the high voltage pins are not touched or exposed to conductive materials, and use a high voltage probe or socket to connect to the pins.
  • The HV5222PJ-G has an operating temperature range of -40°C to +125°C. At higher temperatures, the device's performance may degrade, and the output voltage may drop. It's essential to ensure proper thermal management and heat sinking to maintain reliable operation within the specified temperature range.
  • The HV5222PJ-G can be programmed using the SPI or I2C interface. Microchip provides a programming guide and software tools, such as the MPLAB X IDE, to configure and program the device. Additionally, the HV5222PJ-G can be programmed using third-party programming tools and software.
  • The HV5222PJ-G requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is to apply the VDD supply first, followed by the VPP supply. During power-down, the VPP supply should be removed first, followed by the VDD supply. Microchip provides a detailed power sequencing guide in their application note AN1041.

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HV5222PJ-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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