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HV5522PG-G - Microchip

Description: Serial To Parallel Converter 44-Pin PQFP

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HV5522PG-G - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 44-Lead PQFP Package Outline (PG)
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HV5522PG-G - Microchip  - 3D model - Quad Flat Packages - 44-Lead PQFP Package Outline (PG)
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HV5522PG-G Details

  • Manufacturer Part Number:

    HV5522PG-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    10 X 10 MM, 2.45 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, MO-112AA-2, QFP-44

  • Pin Count:

    44

  • Manufacturer Package Code:

    PQFP-44

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Data Input Mode:

    SERIAL

  • Display Mode:

    DOT MATRIX

  • Interface IC Type:

    EL DISPLAY DRIVER

  • JESD-30 Code:

    S-PQFP-G44

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    32

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP44,.52SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.35 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    10.8 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • fmax-Min:

    8 MHz

HV5522PG-G Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane, and to keep the high-voltage traces short and away from sensitive analog signals. Additionally, use a common mode choke and ferrite beads to filter out high-frequency noise.
  • Use a reliable communication protocol such as SPI or I2C, and ensure that the clock frequency is within the recommended range. Also, use a pull-up resistor on the SDA line and a pull-down resistor on the SCL line to prevent bus contention.
  • The HV5522PG-G can operate from -40°C to +125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal management and heat sinking to prevent overheating.
  • The HV5522PG-G has built-in overvoltage protection, but it's recommended to add external protection circuitry, such as a voltage clamp or a TVS diode, to protect against high-voltage transients and surges.
  • Power up the VCC supply first, followed by the HV supply. Ensure that the VCC supply is stable before applying the HV supply. Also, ensure that the microcontroller is powered up after the HV5522PG-G is fully powered up.

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HV5522PG-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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