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IAM-20380 - TDK

Description: MEMS GYROSCOPE, DIGITAL, LGA-16

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PCB Footprints
IAM-20380 - TDK PCB footprint - Other - Other - 16 Lead LGA (3x3x0.75)
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3D Models
IAM-20380 - TDK  - 3D model - Other - 16 Lead LGA (3x3x0.75)
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IAM-20380 Details

  • Manufacturer Part Number:

    IAM-20380

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LGA-16

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    TDK Corporation

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-XBGA-B16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFLGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Form:

    BUTT

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

IAM-20380 Frequently Asked Questions (FAQs)

  • TDK recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2-layer PCB is recommended, with the component mounted on the top layer and the ground plane on the bottom layer.
  • The IAM-20380 has a maximum operating temperature of 125°C. To ensure reliable operation, it is recommended to provide adequate thermal management, such as a heat sink or thermal pad, to keep the component temperature below 100°C. Additionally, ensure good airflow around the component to prevent overheating.
  • TDK recommends a soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds. The component should be soldered using a solder with a melting point of 217°C or higher. It is also recommended to use a soldering iron with a temperature control to prevent overheating.
  • Yes, the IAM-20380 is designed to withstand high-vibration environments. However, it is recommended to follow TDK's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent mechanical stress.
  • The IAM-20380 should be stored in a dry, cool place away from direct sunlight. The component should be handled with care to prevent mechanical stress and electrostatic discharge (ESD). It is recommended to use anti-static packaging and to follow proper ESD handling procedures when handling the component.

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IAM-20380 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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