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ICL7650SCPA-1Z - Renesas Electronics

Description: The ICL7650S Super Chopper-Stabilized Amplifier offers exceptionally low input offset voltage and is extremely stable with respect to time and temperature. It is a direct replacement for the industry-standard ICL7650 offering improved input offset voltage, lower input offset voltage temperature coefficient, reduced input bias current, and wider common mode voltage range. All improvements are highlighted in bold italics in the Electrical Characteristics section. Critical parameters are guaranteed over the en

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ICL7650SCPA-1Z - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8 Ld PDIP* (Pb-free)
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ICL7650SCPA-1Z - Renesas Electronics  - 3D model - Dual-In-Line Packages - 8 Ld PDIP* (Pb-free)
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ICL7650SCPA-1Z Details

  • Manufacturer Part Number:

    ICL7650SCPA-1Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    E8.3

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    105 dB

  • Common-mode Reject Ratio-Nom:

    115 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    300 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    5.2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.8 mm

  • Slew Rate-Nom:

    2.5 V/us

  • Supply Current-Max:

    3.2 mA

  • Supply Voltage Limit-Max:

    9 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    3162277.66

  • Wideband:

    NO

  • Width:

    4.4 mm

ICL7650SCPA-1Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the ICL7650SCPA-1Z involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability and prevent oscillations, it's essential to follow the recommended compensation network, use a low-ESR output capacitor, and minimize the output capacitance. Additionally, ensure that the input and output traces are well-separated, and the device is properly decoupled.
  • The maximum safe operating area (SOA) for the ICL7650SCPA-1Z is typically defined by the device's maximum junction temperature, output current, and input voltage. It's essential to ensure that the device operates within the recommended SOA to prevent damage or degradation.
  • To protect the ICL7650SCPA-1Z from overvoltage and overcurrent conditions, use a voltage regulator with overvoltage protection, add a current-limiting resistor in series with the output, and consider using a fuse or a polyfuse to prevent excessive current. Additionally, ensure that the device is properly decoupled and the input and output traces are well-separated.
  • A good thermal management strategy for the ICL7650SCPA-1Z involves using a heat sink with a thermal conductivity of at least 1 W/m-K, applying a thermal interface material, and ensuring good airflow around the device. The device's thermal pad should be connected to a solid ground plane to improve heat dissipation.

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ICL7650SCPA-1Z Overview

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