A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
The device is rated for operation up to 150°C. To ensure reliable operation, ensure that the device is properly heatsinked, and the maximum junction temperature is not exceeded. Also, consider derating the current handling capability at higher temperatures.
The device has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. A wrist strap or anti-static mat can be used to prevent damage from static electricity.
The IFSC1008ABER2R2M01 is a commercial-grade device, but Vishay Intertechnologies offers a range of high-reliability and aerospace-grade devices. Contact Vishay for more information on their high-reliability product offerings.
Store the device in a dry, cool place, away from direct sunlight. Avoid bending or flexing the leads, and handle the device by the body, not the leads. Use anti-static packaging and follow standard ESD handling procedures.
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IFSC1008ABER2R2M01 Overview
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