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IH03BQ500K - Vishay

Description: Fixed Inductors Radial Hi Cur 50uH

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IH03BQ500K - Vishay PCB footprint - Other - Other - IH03BQ500K-1
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IH03BQ500K Details

  • Manufacturer Part Number:

    IH03BQ500K

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

IH03BQ500K Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IH03BQ500K is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a thermal via array underneath for optimal thermal performance.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Avoid applying excessive force or pressure during soldering, and ensure the component is properly aligned with the PCB pads.
  • The maximum allowed voltage derating for the IH03BQ500K is 80% of the rated voltage, which is 400 V. This means the maximum allowed voltage is 320 V.
  • To calculate the power dissipation of the IH03BQ500K, use the formula: Pd = (Vds x Ids) / (Rds(on) x Rth(j-a)), where Vds is the drain-source voltage, Ids is the drain-source current, Rds(on) is the on-state resistance, and Rth(j-a) is the junction-to-ambient thermal resistance.
  • The recommended thermal management strategy for the IH03BQ500K is to use a heat sink with a thermal interface material (TIM) to reduce the thermal resistance between the component and the heat sink. Additionally, ensure good airflow around the component to enhance convection cooling.

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IH03BQ500K Overview

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Part Image IH03EB500K Vishay Intertechnologies

General Purpose Inductor, 50uH, 10%, 1 Element, Ferrite-Core