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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLM2525CZER1R0M01
- Part Number IHLM2525CZER1R0M01
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLM2525CZER1R0M01 Details
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Manufacturer Part Number:
IHLM2525CZER1R0M01
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7.6
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Case/Size Code:
2525
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Construction:
Shielded Construction
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Core Material:
COMPOSITE
IHLM2525CZER1R0M01 Frequently Asked Questions (FAQs)
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The recommended land pattern for IHLM2525CZER1R0M01 is a rectangular pad with a size of 2.5 mm x 1.25 mm, with a non-solder mask defined (NSMD) pad shape.
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To handle thermal management, ensure good thermal conductivity between the inductor and the PCB by using a thermal via or a thermal pad. Also, consider using a heat sink or a thermal interface material (TIM) to improve heat dissipation.
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The maximum operating temperature range for IHLM2525CZER1R0M01 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
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To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive bonding, and consider using a vibration-dampening material or a shock-absorbing mount.
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The recommended soldering profile for IHLM2525CZER1R0M01 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
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IHLM2525CZER1R0M01 Overview
Use the download button to access the IHLM2525CZER1R0M01 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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