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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP1616ABER2R2M11
- Part Number IHLP1616ABER2R2M11
- Manufacturer Vishay
- Pin Count 2
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP1616ABER2R2M11 Details
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Manufacturer Part Number:
IHLP1616ABER2R2M11
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7.8
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Case/Size Code:
1616
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Construction:
Rectangular
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Core Material:
COMPOSITE
IHLP1616ABER2R2M11 Frequently Asked Questions (FAQs)
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The recommended land pattern for the IHLP1616ABER2R2M11 is a rectangular pad with a size of 1.6 mm x 1.6 mm, with a non-solder mask defined (NSMD) pad shape.
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To handle the IHLP1616ABER2R2M11's sensitivity to moisture, it is recommended to follow the MSL (Moisture Sensitivity Level) guidelines, which include baking the components before reflow soldering, and using a nitrogen-filled packaging to prevent moisture absorption.
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The maximum operating temperature range for the IHLP1616ABER2R2M11 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
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To ensure the IHLP1616ABER2R2M11 is properly soldered, it is recommended to use a reflow soldering process with a peak temperature of 260°C, and to follow the recommended soldering profile provided in the datasheet.
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The equivalent series resistance (ESR) of the IHLP1616ABER2R2M11 is 0.025 ohms maximum at 100 kHz, and 0.035 ohms maximum at 1 MHz.
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IHLP1616ABER2R2M11 Overview
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