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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP2525BDER2R2MA1
- Part Number IHLP2525BDER2R2MA1
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP2525BDER2R2MA1 Details
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Manufacturer Part Number:
IHLP2525BDER2R2MA1
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7
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Case/Size Code:
2525
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Construction:
Shielded Construction
IHLP2525BDER2R2MA1 Frequently Asked Questions (FAQs)
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The recommended land pattern for IHLP2525BDER2R2MA1 is available in the Vishay Intertechnologies' land pattern document, which can be found on their website. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
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Thermal management is critical for IHLP2525BDER2R2MA1. Ensure good airflow around the component, and consider using a heat sink or thermal interface material to reduce thermal resistance. The datasheet provides thermal impedance information to help with thermal design.
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While the datasheet specifies an operating temperature range of -40°C to +125°C, it's essential to note that the component's performance and reliability may degrade at extreme temperatures. Consult with Vishay Intertechnologies' application engineers for specific guidance on temperature-related design considerations.
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IHLP2525BDER2R2MA1 is designed to withstand moderate vibration levels. However, if your application involves extreme vibration, you should consult with Vishay Intertechnologies' application engineers to discuss potential design modifications or alternative component options.
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To ensure reliability in humid environments, follow proper handling and storage procedures, and consider using conformal coating or potting compounds to protect the component from moisture. Additionally, ensure that the component is properly soldered and that the PCB is designed with moisture-resistant materials.
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IHLP2525BDER2R2MA1 Overview
Use the download button to access the IHLP2525BDER2R2MA1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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