The recommended land pattern for the IHLP2525CZER6R8M11 is a rectangular pad with a size of 2.5 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape.
The IHLP2525CZER6R8M11 has a high current rating, so it's essential to ensure good thermal management. This can be achieved by providing a sufficient copper area on the PCB, using thermal vias, and applying a thermal interface material (TIM) between the inductor and the PCB.
The maximum operating temperature of the IHLP2525CZER6R8M11 is 125°C, with a derating of 1.5% per °C above 80°C.
Yes, the IHLP2525CZER6R8M11 is designed to withstand high-vibration environments. It has a vibration rating of 10 G peak acceleration, 10-2000 Hz, and is suitable for use in applications such as automotive, industrial, and aerospace.
To ensure the reliability of the IHLP2525CZER6R8M11 in a humid environment, it's essential to follow proper storage and handling procedures, and to apply a conformal coating to the PCB. Additionally, the IHLP2525CZER6R8M11 has a moisture sensitivity level (MSL) of 1, which means it can withstand a maximum of 30°C/60% RH for 168 hours.
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IHLP2525CZER6R8M11 Overview
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