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IHLP5050CEER1R0M01 - Vishay

Description: Vishay IHLP5050CE-01 Series Shielded Wire-wound SMD Inductor 1 μH ±20% 40A Idc

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IHLP5050CEER1R0M01 - Vishay - PCB symbol
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PCB Footprints
IHLP5050CEER1R0M01 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - IHLP5050CEERR82M01
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IHLP5050CEER1R0M01 - Vishay - 3D model - Inductors Precision Moulded - IHLP5050CEERR82M01
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IHLP5050CEER1R0M01 Details

  • Manufacturer Part Number:

    IHLP5050CEER1R0M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Case/Size Code:

    5050

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.0035 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3.5 mm

  • Package Length:

    13.2 mm

  • Package Style:

    SMT

  • Package Width:

    12.9 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    24 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP5050CEER1R0M01 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IHLP5050CEER1R0M01 is a rectangular pad with a length of 5.5 mm, a width of 5.0 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape with a minimum of 0.5 mm clearance around the pad.
  • The thermal derating of the IHLP5050CEER1R0M01 should be handled by following the guidelines provided in the datasheet. The inductor's current rating decreases as the ambient temperature increases. The derating curve provided in the datasheet should be used to determine the maximum current rating at a given temperature.
  • The recommended soldering profile for the IHLP5050CEER1R0M01 is a reflow soldering process with a peak temperature of 260°C for a maximum of 10 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • To ensure the reliability of the IHLP5050CEER1R0M01 in high-vibration applications, it is recommended to use a secure mounting method, such as a screw or adhesive, to prevent the inductor from moving or detaching from the PCB. Additionally, the PCB should be designed to minimize flexure and vibration transmission to the inductor.
  • The equivalent series resistance (ESR) of the IHLP5050CEER1R0M01 is not explicitly stated in the datasheet. However, the ESR can be estimated by using the inductor's DC resistance (Rdc) and the inductor's self-resonant frequency (SRF). The ESR can be calculated using the formula: ESR = Rdc / (2 * π * SRF).

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IHLP5050CEER1R0M01 Overview

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