The recommended land pattern for IHLP5050CEERR15M01 is a rectangular pad with a size of 5.5 mm x 5.5 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.15 mm.
Handle the component by the edges or the body, avoiding touching the terminations or the core. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or twisting the component during assembly.
The maximum allowable voltage derating for IHLP5050CEERR15M01 is 10% of the rated voltage. For example, if the rated voltage is 15 V, the maximum allowable voltage derating would be 1.5 V.
IHLP5050CEERR15M01 is rated for operation up to 125°C. However, the component's performance and lifespan may degrade at high temperatures. Consult the datasheet and application notes for guidance on using the component in high-temperature environments.
The inductance tolerance of IHLP5050CEERR15M01 is ±20%. This means that the actual inductance value may vary by up to 20% from the nominal value specified in the datasheet.
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IHLP5050CEERR15M01 Overview
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