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IHLP5050EZER7R8M01 - Vishay

Description: 7.8 µH Shielded Molded Inductor 10 A 20.5mOhm Max Nonstandard

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IHLP5050EZER7R8M01 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - (13.20mm x 12.90mm)
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IHLP5050EZER7R8M01 - Vishay  - 3D model - Inductors Precision Moulded - (13.20mm x 12.90mm)
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IHLP5050EZER7R8M01 Details

  • Manufacturer Part Number:

    IHLP5050EZER7R8M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Case/Size Code:

    5251

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.0205 Ω

  • Inductance-Nom (L):

    7.8 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    5 mm

  • Package Length:

    13.2 mm

  • Package Style:

    SMT

  • Package Width:

    12.9 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    10 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP5050EZER7R8M01 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IHLP5050EZER7R8M01 is a pad size of 5.5 mm x 5.5 mm with a 1.5 mm hole in the center.
  • The IHLP5050EZER7R8M01 is rated for operation up to 125°C, but derating is required above 80°C. Consult the datasheet for specific derating guidelines.
  • Handle the IHLP5050EZER7R8M01 by the body, avoiding touching the leads or core. Use a wrist strap or anti-static mat to prevent ESD damage.
  • The IHLP5050EZER7R8M01 is designed to withstand moderate vibration, but extreme vibration may affect its performance. Consult the datasheet for specific vibration testing results.
  • Use a soldering iron with a temperature of 260°C (500°F) or less, and avoid applying excessive force or bending the leads. Use a solder with a melting point above 217°C (423°F).

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IHLP5050EZER7R8M01 Overview

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