IHV20BZ200 - Vishay

IHV20BZ200 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the IHV20BZ200?
  The recommended PCB footprint for the IHV20BZ200 is a rectangular pad with a minimum size of 5.5 mm x 3.5 mm, with a 1.5 mm x 1.5 mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
• How do I ensure reliable soldering of the IHV20BZ200?
  To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven or a hot air soldering station to solder the component.
• What is the maximum allowed voltage derating for the IHV20BZ200?
  The maximum allowed voltage derating for the IHV20BZ200 is 80% of the rated voltage. For example, if the rated voltage is 200 V, the maximum allowed voltage derating would be 160 V.
• How do I handle the IHV20BZ200 during storage and shipping?
  Handle the IHV20BZ200 with care to prevent mechanical stress, bending, or twisting. Store the components in their original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the components to temperatures above 30°C or humidity above 60%.
• What is the recommended thermal interface material (TIM) for the IHV20BZ200?
  The recommended TIM for the IHV20BZ200 is a thermal grease or thermal tape with a thermal conductivity of at least 1 W/m-K. Apply a thin, even layer of TIM to the thermal pad of the component before mounting it to a heat sink or PCB.