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IMC1210ER2R2K - Vishay

Description: RF Inductors - SMD 2.2uH 10%

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IMC1210ER2R2K - Vishay - PCB symbol
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PCB Footprints
IMC1210ER2R2K - Vishay PCB footprint - Other - Other - IMC1210ER2R2K-2
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IMC1210ER2R2K - Vishay - 3D model - Other - IMC1210ER2R2K-2
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IMC1210ER2R2K Details

  • Manufacturer Part Number:

    IMC1210ER2R2K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    48 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.1

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    POWDERED IRON

  • DC Resistance:

    1 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2.21 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.49 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.32 A

  • Self Resonance Frequency:

    75 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    10%

IMC1210ER2R2K Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device.
  • The maximum power dissipation for the IMC1210ER2R2K is 2.5W. However, this value can be derated based on the ambient temperature and the thermal resistance of the PCB.
  • Yes, the IMC1210ER2R2K is suitable for high-reliability applications. It is built with a robust design and has undergone rigorous testing to ensure its reliability in harsh environments.
  • Handle the device by the body, avoiding touching the leads or electrical contacts. Store the device in its original packaging or an equivalent ESD-protective package to prevent damage from electrostatic discharge.

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IMC1210ER2R2K Overview

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IMC1210ER2R2K Alternates

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Part Image IMC1210ER2R2K Vishay Dale

General Fixed Inductor, 1 ELEMENT, 2.2 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD, CHIP, 1210, ROHS COMPLIANT
Part Image IMC1210SY2R2K Vishay Dale

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Part Image IMC1210AN2R2K Vishay Intertechnologies

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Part Image IMC1210ET2R2K Vishay Intertechnologies

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Part Image IMC1210ET2R2K Vishay Dale

General Fixed Inductor, 1 ELEMENT, 2.2 uH, POWDERED IRON-CORE, GENERAL PURPOSE INDUCTOR, SMD, ROHS COMPLIANT
For a full list of alternate parts for IMC1210ER2R2K, check out Findchips.com