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IR1150ISTRPBF - Infineon

Description: uPFC ONE CYCLE CONTROL PFC IC

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Symbol
IR1150ISTRPBF - Infineon - PCB symbol
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PCB Footprints
IR1150ISTRPBF - Infineon PCB footprint - Other - Other - SOIC127P600X175-8N
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3D Models
IR1150ISTRPBF - Infineon - 3D model - Other - SOIC127P600X175-8N
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IR1150ISTRPBF Details

  • Manufacturer Part Number:

    IR1150ISTRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    15 V

  • Input Voltage-Nom:

    18 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current-Max:

    1.5 A

  • Output Voltage-Max:

    6.8 V

  • Output Voltage-Min:

    5.17 V

  • Output Voltage-Nom:

    6.15 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    40 mA

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    200 kHz

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

IR1150ISTRPBF Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve thermal dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm to 0.5 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10 K/W.
  • The recommended gate drive voltage is 12 V to 15 V, with a maximum of 20 V. A higher gate drive voltage can improve switching performance, but may also increase power consumption.
  • Use a voltage regulator or a voltage supervisor to ensure the input voltage remains within the recommended range of 8 V to 18 V. Add overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage from voltage transients.
  • The recommended dead time is 100 ns to 200 ns for the high-side switch and 50 ns to 100 ns for the low-side switch. This ensures proper switching and prevents shoot-through currents.

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IR1150ISTRPBF Overview

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