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IR1153SPBF - Infineon

Description: PWM PFC Controller IC 22kHz SO-8 International Rectifier IR1153SPBF, Power Factor Controller, 22.2 kHz, 17 V, 8-Pin SOIC

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IR1153SPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead SOIC
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IR1153SPBF - Infineon  - 3D model - Small Outline Packages - 8-Lead SOIC
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IR1153SPBF Details

  • Manufacturer Part Number:

    IR1153SPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    17 V

  • Input Voltage-Min:

    10.8 V

  • Input Voltage-Nom:

    14 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.1 V

  • Output Voltage-Min:

    4.9 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    8 mA

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    25 kHz

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

IR1153SPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and follow the recommended thermal design guidelines. Also, consider using a thermal interface material (TIM) between the device and the heat sink.
  • The maximum allowed voltage on the bootstrap capacitor is 35V. Exceeding this voltage may damage the device.
  • Use a dead-time generator or a dedicated IC with built-in dead-time control to prevent shoot-through currents. Also, ensure that the gate drive signals are properly synchronized and have a sufficient dead-time.
  • A gate resistance of 10-20 ohms is recommended for optimal switching performance. However, the optimal value may vary depending on the specific application and PCB layout.

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