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IR2086STRPBF - Infineon

Description: INFINEON - IR2086STRPBF - MOSFET DRIV, LOW/HIGH SIDE, NSOIC-16

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IR2086STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - soic 16
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IR2086STRPBF - Infineon  - 3D model - Small Outline Packages - soic 16
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IR2086STRPBF Details

  • Manufacturer Part Number:

    IR2086STRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE, MS-012AC, SOIC-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    FULL BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.89 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    1.2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    9.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    15 V

  • Supply Voltage1-Min:

    9.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.03 µs

  • Turn-on Time:

    0.06 µs

  • Width:

    3.9 mm

IR2086STRPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The input capacitor, output capacitor, and transformer turns ratio are critical components to consider when designing a power supply with the IR2086STRPBF.
  • Check the PCB layout, component values, and soldering quality. Verify that the input and output capacitors are properly selected and placed. Use an oscilloscope to analyze the waveforms and identify the root cause of the issue.
  • Use a shielded transformer, ensure proper PCB layout and grounding, and add EMI filters as needed. Follow the recommended layout and component selection guidelines to minimize EMI and ensure EMC compliance.

Trust Checks

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IR2086STRPBF Overview

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