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IR2213STRPBF - Infineon

Description: INFINEON - IR2213STRPBF - MOSFET Driver, High Side and Low Side, 12 V to 20 V Supply, 2 A Out, 225 ns Delay, WSOIC-16

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IR2213STRPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 16 lead soic-
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IR2213STRPBF Details

  • Manufacturer Part Number:

    IR2213STRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.75

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    2.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    12 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    1220 V

  • Supply Voltage1-Min:

    7 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.225 µs

  • Turn-on Time:

    0.28 µs

  • Width:

    7.5 mm

IR2213STRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the IR2213STRPBF involves keeping the high-frequency switching nodes (e.g., drain-source voltage) as small as possible, using a solid ground plane, and minimizing the length of the high-current paths. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper cooling, it's essential to provide a good thermal interface between the device and the heat sink. Apply a thin layer of thermal interface material (TIM) to the device's exposed pad, and use a heat sink with a thermal conductivity of at least 1 W/m-K. Ensure good airflow around the heat sink, and consider using a fan for high-power applications.
  • Monitor the device's junction temperature (TJ), drain-source voltage (VDS), and drain current (ID) to ensure safe operation. Also, keep an eye on the input voltage (VIN) and output voltage (VOUT) to ensure they are within the recommended operating ranges.
  • Use a voltage regulator or a voltage clamp to limit the input voltage to the recommended maximum value. Implement overcurrent protection using a current sense resistor and a comparator or a dedicated overcurrent protection IC. Consider adding a fuse or a PTC (Positive Temperature Coefficient) thermistor to protect against excessive currents.
  • Use ESD-sensitive handling procedures when handling the device. Implement ESD protection on the PCB using TVS (Transient Voltage Suppressor) diodes or ESD protection arrays. Ensure that the PCB design includes a solid ground plane and a dedicated ESD protection network.

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IR2213STRPBF Overview

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