6 X 6 MM, 0.9 MM HEIGHT, ROHS COMPLIANT, PLASTIC, QFN-32
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
4 Weeks
Manufacturer:
Infineon Technologies AG
YTEOL:
0
Additional Feature:
OPERATES IN ADJUSTABLE MODE FROM 0.25 V TO 4.5 V AND 0.25 V TO 5.5 V
Analog IC - Other Type:
SWITCHING REGULATOR
Control Mode:
CURRENT-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
15 V
Input Voltage-Min:
4.5 V
Input Voltage-Nom:
12 V
JESD-30 Code:
S-PQCC-N32
JESD-609 Code:
e3
Length:
6 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
32
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
60 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
QCCN
Package Equivalence Code:
LCC32(UNSPEC)
Package Shape:
SQUARE
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1 mm
Supply Current-Max (Isup):
12 mA
Surface Mount:
YES
Switcher Configuration:
BUCK
Switching Frequency-Max:
1000 kHz
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
NO LEAD
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
40
Width:
6 mm
IR3550MTRPBF Frequently Asked Questions (FAQs)
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
Ensure proper heat sinking, use a thermally conductive material for the PCB, and follow the recommended thermal design guidelines. Also, consider using a thermal interface material (TIM) between the device and the heat sink.
Critical components include the input capacitors, output inductors, and output capacitors. Ensure that these components are selected based on the specific application requirements and follow the recommended component selection guidelines.
Use an oscilloscope to monitor the input and output voltages, and check for any signs of overvoltage, undervoltage, or overheating. Verify that the device is properly soldered and that the PCB layout is correct. Consult the datasheet and application notes for troubleshooting guidelines.
Use a shielded enclosure, ensure proper PCB layout and grounding, and follow the recommended EMI filtering and shielding guidelines. Also, consider using a common-mode choke and a differential-mode filter to reduce EMI emissions.
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IR3550MTRPBF Overview
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