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IRF840A - Vishay

Description: Trans MOSFET N-CH 500V 8A 3-Pin(3+Tab) TO-220AB - Tape and Reel

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IRF840A Details

  • Manufacturer Part Number:

    IRF840A

  • Pbfree Code:

    No

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220AB, 3 PIN

  • Pin Count:

    3

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    510 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    8 A

  • Drain-source On Resistance-Max:

    0.85 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    134 W

  • Pulsed Drain Current-Max (IDM):

    32 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRF840A Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the IRF840A is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal characteristics and voltage ratings. As a general rule, it's recommended to operate the device within the boundaries of the SOA curve provided in the datasheet to ensure reliable operation.
  • The junction-to-case thermal resistance (RθJC) for the IRF840A can be calculated using the thermal resistance values provided in the datasheet. RθJC is typically calculated as the sum of the junction-to-lead thermal resistance (RθJL) and the lead-to-case thermal resistance (RθLC). For the IRF840A, RθJC is approximately 0.5°C/W.
  • The recommended gate drive voltage for the IRF840A is typically between 10V to 15V, depending on the specific application and switching frequency. A higher gate drive voltage can improve switching performance, but may also increase power consumption and EMI.
  • Yes, the IRF840A can be used in high-frequency switching applications, but it's essential to consider the device's switching characteristics, such as the rise and fall times, and the gate charge. The IRF840A has a relatively high gate charge, which may limit its performance in very high-frequency applications (e.g., above 100 kHz).
  • To ensure the IRF840A is properly biased for linear operation, it's essential to provide a stable gate-source voltage (VGS) and a suitable drain-source voltage (VDS). The recommended biasing conditions can be found in the datasheet, and typically involve setting VGS around 4V to 5V and VDS around 10V to 20V, depending on the specific application.

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IRF840A Overview

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Part Image IRF840A Samsung Semiconductor

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