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IRFTS9342TRPBF - Infineon

Description: INFINEON - IRFTS9342TRPBF - MOSFET, P-CH, 30V, 5.8A, 6TSOP

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PCB Footprints
IRFTS9342TRPBF - Infineon PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP-6-2020
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3D Models
IRFTS9342TRPBF - Infineon  - 3D model - SOT23 (6-Pin) - TSOP-6-2020
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IRFTS9342TRPBF Details

  • Manufacturer Part Number:

    IRFTS9342TRPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    5.8 A

  • Drain-source On Resistance-Max:

    0.04 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    46 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFTS9342TRPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRFTS9342TRPBF is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and design, including using a solid ground plane, minimizing trace lengths, and using decoupling capacitors.
  • To prevent electrostatic discharge (ESD) damage, it's essential to follow proper handling and storage procedures, such as using ESD-safe materials, grounding straps, and ionizers.
  • For optimal soldering and rework, follow Infineon's recommended soldering profiles, using a peak temperature of 260°C for a maximum of 10 seconds, and ensuring proper cleaning and drying of the PCB.

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