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IRS2453DSPBF - Infineon

Description: International Rectifier IRS2453DSPBF, Quad MOSFET Power Driver 0.26A Full Bridge, 10 → 16.6 V, 14-Pin SOIC

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IRS2453DSPBF - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead SOIC (narrow body)
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3D Models
IRS2453DSPBF - Infineon  - 3D model - Small Outline Packages - 14-Lead SOIC (narrow body)
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IRS2453DSPBF Details

  • Manufacturer Part Number:

    IRS2453DSPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    FULL BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.26 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    16.6 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    14 V

  • Supply Voltage1-Max:

    600 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

IRS2453DSPBF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a metal plate to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
  • The maximum allowed voltage on the VCC pin is 18V, but it's recommended to operate within the specified range of 12V to 15V for optimal performance and reliability.
  • Use a TVS diode or a transient voltage suppressor on the input lines to protect the device from voltage spikes and surges. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI).
  • A pi-filter or a common-mode choke configuration is recommended to reduce electromagnetic interference (EMI). The filter components should be placed close to the device to minimize radiation.

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IRS2453DSPBF Overview

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Part Image IRS2453DSTRPBF Infineon Technologies AG

Full Bridge Based MOSFET Driver, 0.26A, CMOS, PDSO14