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ISL28227FBZ-T7 - Renesas Electronics

Description: The ISL28227 and ISL28227SEH are very high precision amplifiers featuring very low noise, low offset voltage, low input bias current, and low temperature drift making them the ideal choice for applications requiring both high DC accuracy and AC performance. The combination of precision, low noise and small footprint provides the user with outstanding value and flexibility relative to similar competitive parts. Applications for these amplifiers include precision active filters, medical and analytical instrum

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ISL28227FBZ-T7 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 8 Ld SOIC*1
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ISL28227FBZ-T7 - Renesas Electronics  - 3D model - Small Outline Packages - 8 Ld SOIC*1
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ISL28227FBZ-T7 Details

  • Manufacturer Part Number:

    ISL28227FBZ-T7

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15E

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.012 µA

  • Bias Current-Max (IIB) @25C:

    0.01 µA

  • Common-mode Reject Ratio-Min:

    115 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.01 µA

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    3.6 V/us

  • Supply Current-Max:

    7.4 mA

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    3.9 mm

ISL28227FBZ-T7 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application and frequency range. Renesas recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output decoupling. The application note AN1995 provides more detailed guidance on capacitor selection.
  • The maximum power dissipation of the ISL28227FBZ-T7 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to consult the thermal derating curve in the datasheet to determine the maximum power dissipation for a specific application.
  • The ISL28227FBZ-T7 is rated for operation up to 125°C, but the performance and reliability may degrade at high temperatures. Renesas recommends consulting the datasheet and application notes for guidance on using the op-amp in high-temperature environments.
  • To ensure EMC, Renesas recommends following proper PCB layout and design practices, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering components as necessary. Additionally, the application note AN1995 provides guidance on EMC considerations for the ISL28227FBZ-T7.

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ISL28227FBZ-T7 Overview

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