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ISL28433FBZ-T7A - Renesas Electronics

Description: The ISL28433 is a quad micropower, chopper stabilized operational amplifier that is optimized for single and dual supply operation from 1.65V to 6.0V and ±0.825V to ±3.0V. Their low supply current of 18µA and wide input range enable the ISL28433 to be an excellent general purpose op amp for a wide range of applications. The ISL28433 is ideal for handheld devices that operate off 2 AA or single Li-ion batteries. The ISL28433 is available in 14 Ld TSSOP, 14 Ld SOIC and 14 Ld 3mm x 4mm TDFN packages. The devic

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ISL28433FBZ-T7A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - MDP0027-
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ISL28433FBZ-T7A Details

  • Manufacturer Part Number:

    ISL28433FBZ-T7A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    ROHS COMPLIANT, SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    MDP0027

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CHOPPER-STAB

  • Average Bias Current-Max (IIB):

    1 µA

  • Bias Current-Max (IIB) @25C:

    0.00018 µA

  • Common-mode Reject Ratio-Min:

    115 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    11 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5.15 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -22 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    3 V/us

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    14000

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    4.4 mm

ISL28433FBZ-T7A Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application requirements, such as input voltage, output voltage, and output current. Renesas recommends using X5R or X7R ceramic capacitors with a minimum capacitance of 10uF for the input and output. The datasheet provides more detailed guidelines for capacitor selection.
  • The ISL28433FBZ-T7A is rated for operation from -40°C to +125°C ambient temperature range. However, the device's performance and reliability may be affected at extreme temperatures, and additional thermal management may be required.
  • Renesas provides guidelines for EMC in the application note AN1995, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure compliance with regulatory standards.
  • Renesas recommends a soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds to ensure reliable solder joints and minimize thermal stress on the device.

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