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ISL54225IRTZ-T - Renesas Electronics

Description: The ISL54225 is a single supply dual 2:1 multiplexer that can operate from a single 2.7V to 5.25V supply. It contains two Single Pole/Double Throw (SPDT) switches configured as a DPDT. The part was designed for switching or routing of USB High-Speed signals and/or USB Full-Speed signals in portable battery-powered products. The 6.5Ω switches were specifically designed to pass USB High-Speed/Full-Speed data signals. They have high bandwidth and low capacitance to pass USB High-Speed data signals with minimal

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ISL54225IRTZ-T - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - L10.3x3A
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ISL54225IRTZ-T - Renesas Electronics  - 3D model - Small Outline No-lead - L10.3x3A
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ISL54225IRTZ-T Details

  • Manufacturer Part Number:

    ISL54225IRTZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TDFN

  • Package Description:

    TDFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    L10.3X3A

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    30 dB

  • On-state Resistance Match-Nom:

    0.2 Ω

  • On-state Resistance-Max (Ron):

    20 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Signal Current-Max:

    0.04 A

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

ISL54225IRTZ-T Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. Additionally, it's recommended to place the device close to the power source and use a low-ESR capacitor for power decoupling.
  • To ensure reliable operation over the entire operating temperature range, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider the thermal management of the device, such as providing adequate heat sinking and airflow, and using a thermally conductive material for the PCB.
  • The ISL54225IRTZ-T has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, ESD mat, and ESD-safe tools, as well as avoiding direct contact with the device pins.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes to ensure that the device is being used within its recommended operating conditions. Check the power supply voltage, current consumption, and signal integrity. Use oscilloscopes and logic analyzers to debug the issue, and consider consulting with Renesas support or a qualified engineer if the problem persists.
  • Yes, when using the ISL54225IRTZ-T in a high-reliability or safety-critical application, it's essential to follow the recommended design and testing guidelines, including fault tree analysis, failure mode effects analysis, and environmental testing. Additionally, consider using redundant or fail-safe design techniques, and ensure that the device is properly validated and certified for the specific application.

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ISL54225IRTZ-T Overview

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