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ISL6208IBZ-T - Renesas Electronics

Description: The ISL6208 and ISL6208B are high frequency, dual MOSFET drivers, optimized to drive two N-Channel power MOSFETs in a synchronous-rectified buck converter topology. They are especially suited for mobile computing applications that require high efficiency and excellent thermal performance. These drivers, combined with an Intersil multiphase Buck PWM controller, form a complete single-stage core-voltage regulator solution for advanced mobile microprocessors. ISL6208 and ISL6208B have the same function but dif

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ISL6208IBZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15-ren4
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ISL6208IBZ-T Details

  • Manufacturer Part Number:

    ISL6208IBZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    ROHS COMPLIANT, PLASTIC, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.025 µs

  • Turn-on Time:

    0.03 µs

  • Width:

    3.9 mm

ISL6208IBZ-T Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the component placement and routing symmetrical around the device can help to reduce thermal gradients.
  • To ensure reliable start-up and shutdown of the device, it is recommended to follow a controlled power-up and power-down sequence, with a minimum rise time of 10ms and a maximum fall time of 100ms. Additionally, the input voltage should be ramped up and down slowly to prevent inrush currents and voltage spikes.
  • Operating the device outside of the recommended operating conditions can lead to reduced performance, decreased efficiency, and potentially even damage to the device. It is essential to ensure that the device is operated within the specified temperature range, input voltage range, and output current range to guarantee reliable operation and prevent damage.
  • To troubleshoot issues with the device, it is recommended to follow a systematic approach, starting with a visual inspection of the PCB and component placement. Check for signs of overheating, such as burn marks or discoloration, and verify that the input voltage and output current are within the specified ranges. Use oscilloscopes and other diagnostic tools to measure the device's operating conditions and identify potential issues.
  • Yes, the ISL6208IBZ-T is a high-frequency switching regulator, and as such, it can generate electromagnetic interference (EMI). To minimize EMI, it is recommended to use a shielded inductor, keep the PCB layout compact, and use EMI filters or shielding on the input and output lines. Additionally, the device should be placed in a metal enclosure or shielded compartment to reduce radiated emissions.

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ISL6208IBZ-T Overview

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