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ISL6261AIRZ-T - Renesas Electronics

Description: The ISL6261A is a single-phase buck regulator implementing lntel® IMVP-6® protocol, with embedded gate drivers. lntel® Mobile Voltage Positioning (IMVP) is a smart voltage regulation technology effectively reducing power dissipation in lntel® Pentium processors. The heart of the ISL6261A is the patented R3 Technology™, Intersil's Robust Ripple Regulator modulator. Compared with the traditional multi-phase buck regulator, the R3 Technology™ has faster transient response. This is due to the R3 modulator comma

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ISL6261AIRZ-T - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L40.6x6+
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ISL6261AIRZ-T - Renesas Electronics  - 3D model - Quad Flat No-Lead - L40.6x6+
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ISL6261AIRZ-T Details

  • Manufacturer Part Number:

    ISL6261AIRZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    QFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    L40.6X6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2018-07-18

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    21 V

  • Input Voltage-Min:

    5 V

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    1.5 V

  • Output Voltage-Min:

    0.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    3.6 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    500 kHz

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

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ISL6261AIRZ-T Overview

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