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ISL68200IRZ - Renesas Electronics

Description: The ISL68200 is a single-phase synchronous-buck PWM controller featuring Intersil’s proprietary R4™ Technology. It supports a wide 4. 5V to 24V input voltage range and a wide 0. 5V to 5. 5V output range. Integrated LDOs provide controller bias voltage, allowing for single supply operation. The ISL68200 includes a PMBus/SMBus/I2C interface for device configuration and telemetry (VIN, VOUT, IOUT, and temperature) and fault reporting. Intersil’s proprietary R4 control scheme has extremely fast transient perfor

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ISL68200IRZ - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 24 Ld 4x4 QFN--
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ISL68200IRZ - Renesas Electronics  - 3D model - Quad Flat No-Lead - 24 Ld 4x4 QFN--
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ISL68200IRZ Details

  • Manufacturer Part Number:

    ISL68200IRZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    QFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    L24.4X4C

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    VOUT=(0.5-5.5 VOLT);PFM TECHNIQUE ALSO USED

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    24 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    0.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    10.5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1500 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ISL68200IRZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the exposed pad to the ground plane, and keeping the thermal path as short as possible.
  • Optimizing the compensation network involves selecting the right values for the compensation components (R1, R2, C1, and C2) based on the specific application requirements, such as output voltage, output current, and switching frequency. A good starting point is to use the recommended values in the datasheet and then fine-tune them using simulation tools or empirical methods.
  • The maximum allowed input voltage ripple for the ISL68200IRZ is not explicitly stated in the datasheet, but it is generally recommended to keep the input voltage ripple below 10% of the nominal input voltage to ensure stable operation and prevent damage to the device.
  • Yes, the ISL68200IRZ is rated for operation up to 125°C, but it's essential to ensure that the device is properly cooled and that the maximum junction temperature (Tj) is not exceeded. The device's power dissipation and thermal resistance must be carefully considered to ensure reliable operation in high-temperature environments.
  • Troubleshooting issues with the ISL68200IRZ involves identifying the root cause of the problem, which can be related to the PCB layout, component selection, or configuration. A systematic approach involves checking the input voltage, output voltage, and switching frequency, as well as verifying the compensation network and feedback loop. Simulation tools and oscilloscope measurements can be helpful in identifying the issue.

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ISL68200IRZ Overview

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