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ISL83387EIVZ - Renesas Electronics

Description: The ISL83387E is a 3. 0V to 5. 5V powered RS‑232 transceiver that meets ElA/TIA-232 and V. 28/V. 24 specifications, even at VCC = 3. 0V. Additionally, it provides ±15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS‑232 pins). Targeted applications are industrial laptop computers, Palmtops, PDAs, and notebooks where the low operational power consumption and even lower standby power consumption is critical. Efficient on‑chip charge pumps coupled with

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ISL83387EIVZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M24.173
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ISL83387EIVZ - Renesas Electronics  - 3D model - Small Outline Packages - M24.173
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ISL83387EIVZ Details

  • Manufacturer Part Number:

    ISL83387EIVZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    M24.173

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    NO

  • Driver Number of Bits:

    3

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; TIA-232; V.24; V.28

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    7.8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ISL83387EIVZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, direct traces for the high-frequency signals and avoid vias under the device.
  • Follow the power-up sequence outlined in the datasheet. Ensure the VCC pin is powered up before the VDD pin. Configure the device using the SPI interface, and verify the configuration using the device's status registers.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid blocking the airflow around the device with nearby components.
  • Use the device's built-in diagnostic features, such as the error flags and status registers. Verify the device configuration and power-up sequence. Use an oscilloscope to monitor the device's signals and verify they are within the specified ranges.
  • Yes, follow proper EMI/EMC design practices, such as using a solid ground plane, minimizing loop areas, and using shielding or filtering for sensitive signals. Ensure the device is placed away from noise sources and antennas.

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ISL83387EIVZ Overview

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