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ISL83491IBZ - Renesas Electronics

Description: These Renesas RS-485/RS-422 devices are BiCMOS 3. 3V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Unlike competitive devices, this Renesas family is specified for 10% tolerance supplies (3V to 3. 6V). The ISL83483 and ISL83488 use slew rate limited drivers which reduce EMI, and minimize reflections from improperly terminated transmission lines, or unterminated stubs in multidrop and multipoint applications. Data rates up to 10Mbps are achievable by

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ISL83491IBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
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ISL83491IBZ Details

  • Manufacturer Part Number:

    ISL83491IBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    M14.15

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000025 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.004 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    90 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    35 ns

  • Width:

    3.9 mm

ISL83491IBZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the high-current paths.
  • To ensure stability, use a minimum output capacitance of 10uF, and ensure that the output capacitor's ESR is less than 1 ohm. Also, avoid using ceramic capacitors with high ESL.
  • The ISL83491IBZ can handle input voltages up to 28V, but it's recommended to keep the input voltage below 24V for optimal performance and reliability.
  • The power dissipation of the ISL83491IBZ can be calculated using the formula: Pd = (Vin - Vout) x Iout x Efficiency. The efficiency can be obtained from the datasheet or by measuring the input and output currents and voltages.
  • A thermal pad is exposed on the bottom of the package, which can be connected to a heat sink or a thermal pad on the PCB. Ensure good thermal conductivity between the IC and the heat sink or thermal pad.

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ISL83491IBZ Overview

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